JPH0479131B2 - - Google Patents
Info
- Publication number
- JPH0479131B2 JPH0479131B2 JP59260296A JP26029684A JPH0479131B2 JP H0479131 B2 JPH0479131 B2 JP H0479131B2 JP 59260296 A JP59260296 A JP 59260296A JP 26029684 A JP26029684 A JP 26029684A JP H0479131 B2 JPH0479131 B2 JP H0479131B2
- Authority
- JP
- Japan
- Prior art keywords
- aqueous solution
- alkaline aqueous
- potential
- silicon
- silicon semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26029684A JPS61137330A (ja) | 1984-12-10 | 1984-12-10 | 半導体の微細加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26029684A JPS61137330A (ja) | 1984-12-10 | 1984-12-10 | 半導体の微細加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61137330A JPS61137330A (ja) | 1986-06-25 |
JPH0479131B2 true JPH0479131B2 (en]) | 1992-12-15 |
Family
ID=17346070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26029684A Granted JPS61137330A (ja) | 1984-12-10 | 1984-12-10 | 半導体の微細加工方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61137330A (en]) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02228049A (ja) * | 1989-02-28 | 1990-09-11 | Nec Corp | 半導体装置の製造方法 |
JP5909671B2 (ja) * | 2012-03-27 | 2016-04-27 | パナソニックIpマネジメント株式会社 | 太陽電池の製造方法及び半導体材料からなる基板の製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6130038A (ja) * | 1984-07-23 | 1986-02-12 | Nec Corp | エツチングの方法 |
-
1984
- 1984-12-10 JP JP26029684A patent/JPS61137330A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61137330A (ja) | 1986-06-25 |
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